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GS600SW Wafer-Level Dispensing Machine RDL First WLP CUF Application For Wafer Form Underfill

Changzhou Mingseal Robot Technology Co., Ltd.
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    Buy cheap GS600SW Wafer-Level Dispensing Machine RDL First WLP CUF Application For Wafer Form Underfill from wholesalers
     
    Buy cheap GS600SW Wafer-Level Dispensing Machine RDL First WLP CUF Application For Wafer Form Underfill from wholesalers
    • Buy cheap GS600SW Wafer-Level Dispensing Machine RDL First WLP CUF Application For Wafer Form Underfill from wholesalers
    • Buy cheap GS600SW Wafer-Level Dispensing Machine RDL First WLP CUF Application For Wafer Form Underfill from wholesalers

    GS600SW Wafer-Level Dispensing Machine RDL First WLP CUF Application For Wafer Form Underfill

    Ask Lasest Price
    Brand Name : MingSeal
    Model Number : GS600SW
    Certification : ISO CE
    Price : $1000-$150000
    Payment Terms : L/C, T/T, D/A, D/P, MoneyGram, Western Union
    Delivery Time : 5-60 days
    • Product Details
    • Company Profile

    GS600SW Wafer-Level Dispensing Machine RDL First WLP CUF Application For Wafer Form Underfill

    SS101 Wafer-Level Dispensing Machine


    For Wafer Form Underfill

    SS101 is a highly stable and precise wafer level dispensing system which is developed based on Under fill process requirements of RDL First WLP.

    The equipment meets the needs of the semiconductor industry,can be provided with an automatic wafer loading & unloading system , and can automatically realize functions such as wafer handling , alignment , preheating , operation heating and heat dissipation . It is compatible with international semiconductor communication protocols , and is provided with an AMHS automatic loading & unloading robot interface to match the

    information management requirements and unmanned management trends.

    SS101 System Layout

    ➀ Loadport & Foup

    ➁ Aligner

    ➂ QR code scanning station

    ➃ Pre-heating station

    ➄Heat dissipation station

    ➅GS600SWA Dispensing Machine work station ➆GS600SWB Dispensing Machine work station

    ➇Robot Handling module

    Composition of SS101 Wafer-Level Dispensing System

    • GS600SW wafer-level dispensing machine × 2
    • PC101 wafer loading & unloading machine × 1

    Application Fields

    • RDL First WLP
    • CUF Application

    SS101 Wafer-Level Dispensing Operation Flow

    QQ截图20230207112218

    Features and Advantages

    • Supporting 8/12-inch wafer dispensing.
    • Dustproof level 10, meeting the environmental requirements of wafer level packaging.
    • ESD protection meeting international IEC and ANSI standards.
    • In the whole process of wafer turnover and operation, the temperature is finely controlled and automatically corrected to meet the CUF process requirements while ensuring the product safety.
    • The whole-process video monitoring facilitates product turnover, operation process observation, and problem tracing and analysis

    Technical Specifications

    SS101 systemGS600SWA * 1 ,GS600SWB * 1, PC101 Wafer Handling Machine * 1 (EFEM)
    Application FieldsRDL First WLP, CUFApplication
    Cleanliness LevelCleanliness of working area

    Class 100 (Class 1000 workshop)

    Class 10 (Class 100 workshop)


    Product Application Fields

    Support for wafer size

    φ200mm±0 .5mm, φ300mm±0.5mm

    (Standard model supports 12-inch wafers only)

    Support for wafer thickness300-2550μ m
    Allowable wafer max. warpage range<5mm (as per Robot Finger type)
    Allowable max.wafer weight600g (as per Robot Finger type)
    Wafer cassette form8 inches Open Cassette,12 inches Foup (Standard model supports 12-inch wafers only)


    PC101(EFEM)

    Loading&unloading methodLoadport+Robots
    Pre-Aligner accuracyRound center correction deviation≤±0 . 1mm; Angle correction deviation≤±0 .2 °
    Wafer readerSupports SEMI fonts (Flat or concave/convex surfaces) ,non-SEMI fonts
    Preheating temp. rangeRoom temperature~180℃
    Wafer cooling methodNatural cooling or air cooling


    Dispensing Motion System

    Transmission mechanismsX/Y: Linear motor Z: Servo motor&Screw module
    RepeatabilityX/Y: ±3μ mZ: ±5μ m
    Positioning accuracyX/Y: ±10μ m
    Max. movement speedX/Y: 1000mm/s Z: 500mm/s
    Max. accelerated velocityX/Y: 1g Z: 0 .5g

    Vision System

    Camera pixels130W
    Recognition accuracy±1 Pixel
    Recognition range12 × 16mm<Recognition range<19 .2 ×25 .6mm
    Light sourceCombined three-color light source red, green, white + red
    Weighing Calibration SystemWeighing accuracy0.01mg


    Chuck Table Load Tray

    Vacuum surface flatness deviation≤ 3 0 um
    Heating temp.rangeRoom temperature~180℃
    Heating temp. deviation≤ ± 1 . 5 ℃
    Repeatability of lifting height±10 μ m
    Vacuum suction pressure-70~-85Kpa Settable





    Facilities

    Footprint (W*D*H)3075×2200×2200mm(Display unfolded)
    Weight2.9t
    Power supply200~240VAC,47~63HZ (Single-phase voltage adaptation power supply)
    Electric current75A
    Power16.5KW
    Inhale(0.5Mpa, 450L/min) ×5 way
    Operating ambient temp.23℃±3℃
    Relative humidity of working environment30 ~ 70%

    Quality GS600SW Wafer-Level Dispensing Machine RDL First WLP CUF Application For Wafer Form Underfill for sale
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