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GS600SU Underfill Dispensing Machine FCBGA, FCCSP, SIP Die Form Underfill Die Form Underfill

Changzhou Mingseal Robot Technology Co., Ltd.
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    Buy cheap GS600SU Underfill Dispensing Machine FCBGA, FCCSP, SIP Die Form Underfill Die Form Underfill from wholesalers
     
    Buy cheap GS600SU Underfill Dispensing Machine FCBGA, FCCSP, SIP Die Form Underfill Die Form Underfill from wholesalers
    • Buy cheap GS600SU Underfill Dispensing Machine FCBGA, FCCSP, SIP Die Form Underfill Die Form Underfill from wholesalers
    • Buy cheap GS600SU Underfill Dispensing Machine FCBGA, FCCSP, SIP Die Form Underfill Die Form Underfill from wholesalers

    GS600SU Underfill Dispensing Machine FCBGA, FCCSP, SIP Die Form Underfill Die Form Underfill

    Ask Lasest Price
    Brand Name : MingSeal
    Model Number : GS600SU
    Certification : ISO
    Price : $28000-$150000
    Payment Terms : L/C, T/T, D/A, D/P, MoneyGram, Western Union
    Delivery Time : 5-60 days
    • Product Details
    • Company Profile

    GS600SU Underfill Dispensing Machine FCBGA, FCCSP, SIP Die Form Underfill Die Form Underfill

    GS600SU Underfill Dispensing Machine


    For Die Form Underfill

    GS600 SU is a high- speed and high- precision automatic online dispensing system which is developed based on Underfill process requirements of FCBGA/FCCSP.

    The system strictly controls the product and adhesive temperature, and intelligently sorts the product operation sequence and the glue replenishment time, reducing the generation of voids and ensuring the operation yield. Meanwhile, it is compatible with international semiconductor communication protocols, and matches the infor- mation management requirements.

    Application Fields
    FCBGA Packaging CUF Application FCCSP Packaging CUF Application SiP Packaging CUF Application


    ■ Technical Specifications

    Application FieldsFCBGA, FCCSP, SIP
    Applicable ProcessDie Form Underfill
    Cleanliness LevelCleanliness of working area

    Class 100 (Class 1000 workshop)
    Class 10 (Class 100 workshop)




    Transmission

    Mechanism

    Transmission systemX/Y:Linear motor Z: Servo motor&Screw module
    Repeatability (3sigma)X/Y: ±0.003mm, Z: ±0.005mm
    Positioning accuracy (3sigma)X/Y: ±0.010mm, Z: ±0.015mm
    Max. movement speedX/Y: 1000mm/s
    Z: 500mm/s
    Max. accelerated velocityX/Y: 1g, Z: 0.5g
    Grating resolution1 μ m
    Z axis movement range(W× D)3 5 0 mm×4 7 0mm
    Z axis height calibration & compensation MethodLaser sensor (Laser sensor)
    Laser sensor accuracy2μ m





    Dispensing System

    Glue control accuracy± 3 % / 1mg
    Single dot position repeatability CPK>1.0±25 μ m
    Min. nozzle diameter30 μ m
    Min. single dot glue weight0 .001mg/dot
    Max. fluid viscosity200000cps
    Max. jetting frequency1000Hz
    Runner/nozzle heating temperatureRoom temperature~200℃
    Runner/nozzle heating temp. deviation± 2 ℃
    Applicable adhesive packaging spec.5CC/10CC/30CC/50CC/70CC
    Syringe cooling rangeCools down to 15°C below ambient temp.
    Piezo cooling rangeCools down to compressed air source temp.






    Track System

    Number of tracks2
    Number of belt sectionsOne piece
    Max. track transmission speed300mm/s
    Max. track transmission weight3kg
    Minimum edge clearance3 mm
    Track width adjustment range60mm~ 162mm Adjustable
    Track width adjustment MethodManual
    Track height910mm~960mm Adjustable
    Max. thickness of applicable substrate/carrier6 mm
    Applicable substrate/carrier length range60mm-325mm
    Vacuum suction pressure Range-50~-80Kpa Adjustable
    Bottom heating temperature rangeRoom temperature~180℃
    Bottom heating temp. deviation≤ ± 1 . 5 ℃



    Facilities

    Footpri nt W× D× H2380mm*1550mm*2080mm(Loading&Unloading& display included)
    2380mm*1200mm*2080mm(Loading&Unloading included, display excluded)
    Weight1600kg
    Power supply200~240VAC,47~63HZ (Single-phase voltage adaptation power supply)
    Electric current30A
    Power6.4KW
    Inhale(0.5Mpa, 450L/min) ×2
    • FCBGA Packaging CUF Application
    • FCCSP Packaging CUF Application
    • SiP Packaging CUF Application

    Special Process Modules

    • shijuexitong

      CUF Special Piezoelectric Jetting System
      Adhesive insulation + piezoelectric ceramic temperature closed-loop control to avoid system instability caused by temperature influence

    • Triple Low-level Alarm

      Triple Low-level Alarm
      Capacitive detection + magnetic detection + system weighing to avoid poor operation caused by lack of glue

    • Vacuum Adsorption Heating Fixture

      Vacuum Adsorption Heating Fixture
      The temperature difference of the whole surface of the fixture is ≤ ±1.5°C, and the temperature is monitored and compensated in real time to avoid poor operation caused by product temperature variation during operation

    • Press-Down Track

      Press-Down Track
      The vacuum adsorption fixture always keeps still, and the track moves up and down to avoid poor operation caused by loss of flatness during reciprocating movement of the vacuum adsorption fixture.

    • 平台式上下料系统

      Platform-Type Loading & Unloading System
      The feeding sequence is automatically sorted, and the operation is completed within the Plasma time limit
      Friendly human-machine interface design

    • 视觉系统

      Visual system
      Positioning and detection functions
      Inspection before operation to avoid defective incoming materials
      Inspection after operation to prevent batch defects

    Quality GS600SU Underfill Dispensing Machine FCBGA, FCCSP, SIP Die Form Underfill Die Form Underfill for sale
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