AS200 Series High Speed Die Bonder

The AS200 series high- speed dispensing and bonding machine can be applied in the advanced MEMS bonding process to achieve die bonding of high-density and high-reliability, and supports versatile packages, such as QFN, SIP, LGA , BGA and FC , for a variety of different application

scenarios . Various advanced technologies and innovative processes are used in the design and production of the AS200 to ensure its high speed, high accuracy and versatility.

The AS200's modular whole-set design allows for rapid inline production and supports " Direct Attach-Flip Chip" function switching, making production more flexible and efficient.

In addition, the AS200 can be optionally designed to meet the DAF film heating process through its forward-looking track design , and achieve stable , high-speed and high-precision production through the optimized design of the dispensing and pick & place mechanisms and the reconfiguration of the motion logic.

The technical specifications and performance of AS200 meet international standards , making it a high performance , highly reliable and internationally competitive dispensing and die attaching machine, enabling customers to have minimal cost and maximum ROI.

Features and Advantages

• High-speed / high-precision die bonding process

Nearest handling path planning as per enabled modules.
Automatic calibration and bonding force monitoring with editable cycles.
Active vibration suppression system with <5um amplitude in the die bonding area at full speed.
Lightweight and rigid high-speed die bonding module with a max. speed of 15m/s.

• Expandability and configurability

Dust-proof jacket selectable.
Loading methods compatible for multiple forms of substrate/frame.
Substrate heating by changing tooling supportive.
Thin chip picking process by changing configuration supportive.
Capable of switchingand between Face-up bonding and Flip-chip bonding by adding and replacing configurations.

• Stable glue control process

Visual inspection automatic adjustment of glue volume.
Optimal high speed and low vibration glue dispensing path planning.
Self-developed high precision dispensing controller of international standard.
Innovative lightweight decoupling dispensing mechanism with a max. accelerated velocity of 2.5g.

• Advanced technology and innovative process

Core functions and technical parameters are on par with international competitors.
Core modules are self-developed to ensure subsequent expansion and upgrading.
Module-based agile architecture design to build advanced software matrix capability.
Capable of handling 12-inch wafers, comparable to competing 8-inch die bonder in terms of footprint.

• Sensor Housing Mounting
• Holder Mounting
• Reinforcement Plate Mountin
• Main Camera And Auxiliary Camera Mounting
• VCM Mounting

Technical Specifications

Established in 2008, Changzhou Mingseal Robot Technology Co., Ltd. (hereinafter referred to as “Mingseal Technology”) is a technology-driven high-end equipment manufacturing enterprise which is committed to providing connection, assembly equipment, key core components and other technology solutions for industry-leading customers in the field of semiconductor packaging & testing and precision electronic manufacturing so as to jointly promote the industry technique and technology progress. Our products are widely used by top-tier customers of advanced semiconductor packaging, consumer precision electronics and intelligent automotive electronics, etc., and our business and technology support network covers such countries as China, Japan, South Korea, Vietnam, Singapore, India, Thailand, Malaysia and Mexico.

Mingseal Technology has got a number of qualifications and honors such as National High-Tech Enterprise, National Intellectual Property Demonstration Enterprise and National “Specialized, Fined, Peculiar and Innovative” Small Giant Enterprise. In the era of intelligence and digitalization, Mingseal Technology will continue increasing the investment in technological innovation R&D, adhere to cooperation and sharing values, and work with customers, suppliers, employees and other partners to achieve more high-end intelligent manufacturing.